Abstract: In this study, an approach for enhanced lifetime modelling of wire bonds has been investigated. Numerical simulations of a 3D wire bond model have been used to acquire a suitable damage ...
Surge模块：https://raw.githubusercontent.com/monlor/apple-crack-scripts/main/APPheji_Guding.sgmodule Loon插件：https://raw.githubusercontent.com/monlor/apple ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback