Press-fit terminals provide a solder-free capability to mount power modules to a printed circuit board (PCB). Microchip Technology Inc. has announced a broad portfolio of SP1F and SP3F power modules ...
Applications such as those involving electromobility require high-quality miniaturized power electronics to complement electric and hybrid drives. The manufacture of such power electronic devices in ...
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Infineon Technologies AG today launches bipolar power modules in solder bond technology to address the specific requirements of cost-effective applications. With these new PowerBlock modules the ...
pv magazine’s UP sustainability campaign has investigated the use of lead in PV panels and found, with soldered cell interconnections in particular, viable alternatives are scarce. However, German ...
Previously, a Power Electronics Technology article titled “Inverted Acoustic System Cuts IGBT Failures” (September 2011) examined the use of an acoustic microscope to image heat-blocking defects such ...
SHENMAO Technology proudly presents its latest innovation, the PF719-P250A solder paste, specifically designed for AI substrate power management modules. This cutting-edge solder paste represents a ...
Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor applications, and renewable energy solutions such as wind and solar power.
In contrast to semiconductor devices for information processing, power semiconductors may experience a high number of temperature cycles during their lifetime in field usage. Therefore it is a ...
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