As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ultra-thin silicon membranes and low-temperature manufacturing techniques to overcome a major obstacle that has long blocked the production of true 3D chips.

The chip industry is the most complex that you could imagine, and quantum computing, intrinsically, is based on some of the most complex, non-intuitively understandable math that humankind has ever discovered,

Engineers and researchers are assembling the technical groundwork for manufacturing semiconductor materials on the Moon, drawing on lunar soil as a raw feedstock for silicon-based devices. The concept, which spans peer-reviewed journal papers, NASA ...

Current copper wiring in computer chips struggles to carry electricity efficiently as circuits shrink to the nanoscale, leading to a process that generates heat and limits performance. These materials could make future chips faster, more energy-efficient ...

A 2D material called chromium oxychloride dramatically outperforms traditional hard masks in chip fabrication, resisting plasma etching far better at nanoscale thicknesses. (Nanowerk News) Making computer chips smaller is not just about better design.

TSMC’s capacity struggles are turning into a boon for Intel. As the Taiwanese chip making giant struggles to meet overwhelming demand for its chip manufacturing capacity, several major AI chip design companies,

President Donald Trump’s ambiguous plans for 100% tariffs on computer chips that aren’t made in the U.S. are stoking confusion among businesses

Editor's NoteFrom AI and semiconductors to telecommunications and biotech, we break down the essential yet often unfamiliar technologies that shape ou

Transistors etched into the latest processor designs now measure just a few nanometers across, placing them well below the physical size of a common virus particle. That comparison is not metaphorical.